View CM1401-03CS_1226737.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

CM1401-03 4-Channel ESD/EMI Filter Array plus 4-Channel ESD Array for USB
Features
* * * * * * * * * * * Functionally and pin compatible with CSPEMI307A device OptiguardTM coated for improved reliability at assembly Four channels of combined EMI/RFI filtering + ESD protection Four additional channels of ESD-only protection 40dB absolute attenuation (typical) at 1 GHz 35dB attenuation (typical) at 1 GHz relative to pass band 15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) 30kV ESD protection on all channels (HBM) 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance Lead-free version available
Product Description
The CM1401-03 is a multichannel array with four lowpass filter + ESD channels and four ESD-only channels. They reduce EMI/RFI emissions on a data port and protect against ESD on a USB port. Each EMI/RFI channel integrates a high quality pi-style filter (C-R-C) which provides greater than 30dB attenuation in the 800-2700 MHz range relative to the pass band attenuation. These pi-style filters are bidirectional, controlling EMI both to and from a data port connector. The CM1401-03 provides a high-level of ESD protection on all eight channels for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of 15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 30kV. The CM1401-03 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CM1401-03 incorporates OptiguardTM coating which results in improved reliability at assembly and is available in a space-saving, low-profile chip scale package with optional lead-free finishing.
Applications
* * * * * * * EMI filtering and ESD protection for both data and I/O ports Outer 4 channels provide ESD protection for USB lines and other I/O port applications Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs
Electrical Schematic
100 FILTER+ESDn* 30pF 30pF FILTER+ESDn* ESDn* 30pF
GND (Pins B1-B3)
1 of 4 EMI/RFI + ESD Channels.
* See Package/Pinout Diagram for expanded pin information
1 of 4 ESD-only Channels
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
1
CM1401-03
PACKAGE / PINOUT DIAGRAMS (Bumps Down View)
Orientation Marking (see note 2)
TOP VIEW
BOTTOM VIEW
(Bumps Up View)
FILTER+ESD_2
1 A B C
2
3
4
5
6
ESD_3 FILTER+ESD_4
C1
C2
FILTER+ESD_1
C3
GND
C4
FILTER+ESD_3
C5
GND
C6
ESD_4
N013
GND
B1 A2
FILTER+ESD_1
B2 A4
FILTER+ESD_3
B3 A6
ESD_2
Orientation Marking
ESD_1
FILTER+ESD_2
FILTER+ESD_4
A1
A1
A3
A5
Notes: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1401-03
PIN DESCRIPTIONS
PIN(s) A1 A2 A3 A4 A5 A6 B1-B3 C1 C2 C3 C4 C5 C6 NAME ESD_1 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_2 GND ESD_3 FILTER+ESD_1 FILTER+ESD_2 FILTER+ESD_3 FILTER+ESD_4 ESD_4 DESCRIPTION ESD Channel 1 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 2 Device Ground ESD Channel 3 Filter + ESD Channel 1 Filter + ESD Channel 2 Filter + ESD Channel 3 Filter + ESD Channel 4 ESD Channel 4
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Pins 15 Package CSP Ordering Part Number1 CM1401-03CS Part Marking N013 Lead-free Finish2 Ordering Part Number1 CM1401-03CP Part Marking N013
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
10/04/05
CM1401-03
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 600 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL R C TCR TCC VDIODE ILEAK VSIG PARAMETER Resistance Capacitance Temperature Coefficient of Resistance Temperature Coefficient of Capacitance Diode Voltage (reverse bias) Diode Leakage Current (reverse bias) Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off Frequency ZSOURCE=50, ZLOAD=50 At 2.5V DC IDIODE=10A VDIODE=3.3V ILOAD = 10mA 5.6 -1.5 30 15 Notes 2,3 and 4 +10 -5 R=100 , C=30pF 58 MHz V V 6.8 -0.8 At 2.5V DC CONDITIONS MIN 80 24 TYP 100 30 1200 -300 6.0 100 9.0 -0.4 MAX 120 36 UNITS pF ppm/C ppm/C V nA V V kV kV
VESD
Notes 2 and 4
VCL
fC
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: These parameters are guaranteed by design and characterization.
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CM1401-03
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A2-C2 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A3-C3 to GND B2)
(c) 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
10/04/05
CM1401-03
Performance Information
Typical Filter Performance (TA=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A4-C4 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A5-C5 to GND B2)
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CM1401-03
Performance Information
Typical Filter Performance (TA=25C, 50 Ohm Environment)
Figure 5. Comparison of Filter Response Curves for CM1401-03CS with DC Bias
(c) 2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
10/04/05
CM1401-03
Performance Information (cont'd)
1.6
1.5
1.4
Normalized Capacitance
1.3
1.2
T = -40C T = +25C T = +70C
1.1
1.0
0.9
0.8
0.7 0 1 2 3 4 5
DC Input Voltage (V)
Figure 6. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25C)
1.100 1.080 1.060
Nornalized Resistance
1.040 1.020 1.000 0.980 0.960 0.940 0.920 0.900 -40 -20 0 20 40 60 80 100 Temperature ['C]
Figure 7. Resistance vs. Temperature (normalized to resistance at 25C)
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
7
CM1401-03
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 240C 260C
Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 9. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2005 California Micro Devices Corp. All rights reserved.
Figure 10. Lead-free (SnAgCu) Solder Ball Reflow Profile
Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
10/04/05
CM1401-03
Mechanical Details
CSP Mechanical Specifications The CM1401-03 is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document.
C1
Mechanical Package Diagrams
BOTTOM VIEW
A1 B1 C B A B2 B4 B3
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 15 Inches Nom Max
A2
C2
1
2
3
4
5
6 D1 D2
2.915 2.960 3.005 0.1148 0.1165 0.1183 1.285 1.330 1.375 0.0506 0.0524 0.0541 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.180 0.230 0.280 0.0071 0.0091 0.0110 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
SIDE VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1401-03 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER CM1401-03 CHIP SIZE (mm) 2.96 X 1.33 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 3.10 X 1.45 X 0.74
Po Top Cover Tape
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W Bo
Ko
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 11. Tape and Reel Mechanical Data
(c) 2005 California Micro Devices Corp. All rights reserved. 10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
9

▲Up To Search▲

Price & Availability of CM1401-03CS

	To Download CM1401-03CS Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .